The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Jul. 29, 2010
Hsiang-huan Lee, Jhudong, TW;
Ming Han Lee, Taipei, TW;
Ming-shih Yeh, Chupel, TW;
Chen-hua Yu, Hsin-Chu, TW;
Shau-lin Shue, Hsinchu, TW;
Hsiang-Huan Lee, Jhudong, TW;
Ming Han Lee, Taipei, TW;
Ming-Shih Yeh, Chupel, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Shau-Lin Shue, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
The structures and methods described above provide mechanisms to improve interconnect reliability and resistivity. The interconnect reliability and resistivity are improved by using a composite barrier layer, which provides good step coverage, good copper diffusion barrier, and good adhesion with adjacent layers. The composite barrier layer includes an ALD barrier layer to provide good step coverage. The composite barrier layer also includes a barrier-adhesion-enhancing film, which contains at least an element or compound that contains Mn, Cr, V, Ti, or Nb to improve adhesion. The composite barrier layer may also include a Ta or Ti layer between the ALD barrier layer and the barrier-adhesion-enhancing layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile