The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Jul. 10, 2008
Weng-jin Wu, Hsin-Chu, TW;
Ku-feng Yang, Dali, TW;
Jung-chih HU, Yangmei, TW;
Wen-chih Chiou, Miaoli, TW;
Chen-hua Yu, Hsin-Chu, TW;
Weng-Jin Wu, Hsin-Chu, TW;
Ku-Feng Yang, Dali, TW;
Jung-Chih Hu, Yangmei, TW;
Wen-Chih Chiou, Miaoli, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method for singulating semiconductor wafers is disclosed. A preferred embodiment comprises forming scrub lines on one side of the wafer and filling the scrub lines with a temporary fill material. The wafer is then thinned by removing material from the opposite side of the wafer from the scrub lines, thereby exposing the temporary fill material on the opposite side. The temporary fill material is then removed, and the individual die are removed from the wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile