The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2010

Filed:

Aug. 09, 2005
Applicants:

Siqing LU, San Jose, CA (US);

Qiwei Liang, Fremont, CA (US);

Irene Chou, San Jose, CA (US);

Steven H. Kim, Union City, CA (US);

Young S. Lee, San Jose, CA (US);

Ellie Y. Yieh, San Jose, CA (US);

Muhammad M. Rasheed, Fremont, CA (US);

Inventors:

Siqing Lu, San Jose, CA (US);

Qiwei Liang, Fremont, CA (US);

Irene Chou, San Jose, CA (US);

Steven H. Kim, Union City, CA (US);

Young S. Lee, San Jose, CA (US);

Ellie Y. Yieh, San Jose, CA (US);

Muhammad M. Rasheed, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
Abstract

An RF coil assembly provides a source to generate a plasma inductively in a process chamber. The RF coil assembly includes an RF coil disposed about a perimeter of the processing chamber and a frame disposed about a perimeter of the processing chamber. The frame is adapted to support the RF coil in position. An interface material is disposed between and in thermal contact with the frame and a sidewall of the processing chamber. The interface material has a thermal conductivity of 4.0 W/mK or greater.


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