The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Jul. 15, 2008
Kenji Suzuki, Guilderland, NY (US);
Frank M. Cerio, Jr., Albany, NY (US);
Miho Jomen, Albany, NY (US);
Shigeru Mizuno, Delmar, NY (US);
Yasushi Mizusawa, Yamanashi, JP;
Tadahiro Ishizaka, Watervliet, NY (US);
Kenji Suzuki, Guilderland, NY (US);
Frank M. Cerio, Jr., Albany, NY (US);
Miho Jomen, Albany, NY (US);
Shigeru Mizuno, Delmar, NY (US);
Yasushi Mizusawa, Yamanashi, JP;
Tadahiro Ishizaka, Watervliet, NY (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method for integrating ruthenium (Ru) metal cap layers and modified Ru metal cap layers into copper (Cu) metallization of semiconductor devices to improve electromigration (EM) and stress migration (SM) in bulk Cu metal. In one embodiment, the method includes providing a planarized patterned substrate containing a Cu metal surface and a dielectric layer surface, depositing first Ru metal on the Cu metal surface, and depositing additional Ru metal on the dielectric layer surface, where the amount of the additional Ru metal is less than the amount of the first Ru metal. The method further includes at least substantially removing the additional Ru metal from the dielectric layer surface to improve the selective formation of a Ru metal cap layer on the Cu metal surface. Other embodiments further include incorporating one or more types of modifier elements into the dielectric layer surface, the Cu metal surface, the Ru metal cap layer, or a combination thereof.