The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Jan. 29, 2007
T. Todd Crkvenac, Hockessin, DE (US);
Clyde A. Fawcett, Claymont, DE (US);
Mary JO Kulp, Newark, DE (US);
Andrew Scott Lawing, Phoenix, AZ (US);
Kenneth A. Prygon, Bear, DE (US);
T. Todd Crkvenac, Hockessin, DE (US);
Clyde A. Fawcett, Claymont, DE (US);
Mary Jo Kulp, Newark, DE (US);
Andrew Scott Lawing, Phoenix, AZ (US);
Kenneth A. Prygon, Bear, DE (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Abstract
The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has an ultimate tensile strength of at least 3,000 psi (20.7 MPa) and polymeric matrix containing closed cell pores. The closed cell pores have an average diameter of 1 to 50 μm and represent 1 to 40 volume percent of the polishing pad. The pad texture has an exponential decay constant, τ, of 1 to 10 μm as a result of the natural porosity of the polymeric matrix and a surface texture developed by implementing periodic or continuous conditioning with an abrasive. The surface texture has a characteristic half height half width, Wthat is less than or equal to the value of τ.