The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Oct. 09, 2006
Clinton Chao, Hsinchu, TW;
Tsorng-dih Yuan, Hsinchu, TW;
Hsin-yu Pan, Taipei, TW;
Kim Chen, Fremont, CA (US);
Mark Shane Peng, Hsinchu, TW;
Tjandra Winata Karta, Hsinchu, TW;
Clinton Chao, Hsinchu, TW;
Tsorng-Dih Yuan, Hsinchu, TW;
Hsin-Yu Pan, Taipei, TW;
Kim Chen, Fremont, CA (US);
Mark Shane Peng, Hsinchu, TW;
Tjandra Winata Karta, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A stacked structure includes a first die coupled to a first substrate and having a first conductive structure formed through the first die. A second die is mounted over the first die. The second die is coupled to the first substrate by the first conductive structure. At least one first support structure formed from a second substrate is provided over the first substrate, adjacent to at least one of the first die and the second die. A top surface of the first support structure is substantially coplanar with a top surface of at least one of the first and second dies adjacent to the first support structure. The stacked structure further includes a heat spreader mounted over the second die.