The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Sep. 29, 2004
Applicants:
Tsuyoshi Matsuda, Kasugai, JP;
Tatsuhiko Hirano, Kakamigahara, JP;
Junhui OH, Inuyama, JP;
Atsunori Kawamura, Owariasahi, JP;
Kenji Sakai, Nagoya, JP;
Inventors:
Tsuyoshi Matsuda, Kasugai, JP;
Tatsuhiko Hirano, Kakamigahara, JP;
Junhui Oh, Inuyama, JP;
Atsunori Kawamura, Owariasahi, JP;
Kenji Sakai, Nagoya, JP;
Assignee:
Fujimi Incorporated, Nishikasugai-Gun, Aichi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 3/02 (2006.01); C09C 1/68 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from the group consisting of carboxylic acid and alpha-amino acid; a corrosion inhibitor; an oxidant; and water. This polishing composition is capable of suppressing the occurrence of the dishing.