The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2008
Filed:
Oct. 28, 2005
Christoph Dolainsky, Wessling, DE;
Jonathan O. Burrows, San Jose, CA (US);
Dennis Ciplickas, San Jose, CA (US);
Joseph C. Davis, San Jose, CA (US);
Rakesh Vallishayee, San Jose, CA (US);
Howard Read, San Jose, CA (US);
Larg. H. Weiland, Livermore, CA (US);
Christopher Hess, San Carlos, CA (US);
Christoph Dolainsky, Wessling, DE;
Jonathan O. Burrows, San Jose, CA (US);
Dennis Ciplickas, San Jose, CA (US);
Joseph C. Davis, San Jose, CA (US);
Rakesh Vallishayee, San Jose, CA (US);
Howard Read, San Jose, CA (US);
Larg. H. Weiland, Livermore, CA (US);
Christopher Hess, San Carlos, CA (US);
PDF Solutions, Inc., San Jose, CA (US);
Abstract
A hot spot is identified within a mask layout design. The hot spot represents a local region of the mask layout design having one or more feature geometries susceptible to producing one or more fabrication deficiencies. A test structure is generated for the identified hot spot. The test structure is defined to emulate the one or more feature geometries susceptible to producing the one or more fabrication deficiencies. The test structure is fabricated on a test wafer using specified fabrication processes. The as-fabricated test structure is examined to identify one or more adjustments to either the feature geometries of the hot spot of the mask layout design or the specified fabrication processes, wherein the identified adjustments are capable of reducing the fabrication deficiencies.