The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Apr. 12, 2007
Toshifumi Kimba, Fujisawa, JP;
Tohru Satake, Chigasaki, JP;
Tsutomu Karimata, Yokohama, JP;
Kenji Watanabe, Fujisawa, JP;
Nobuharu Noji, Zushi, JP;
Takeshi Murakami, Tokyo, JP;
Masahiro Hatakeyama, Fujisawa, JP;
Mamoru Nakasuji, Yokohama, JP;
Hirosi Sobukawa, Zama, JP;
Shoji Yoshikawa, Hachioji, JP;
Shin Oowada, Yokohama, JP;
Mutsumi Saito, Yokohama, JP;
Toshifumi Kimba, Fujisawa, JP;
Tohru Satake, Chigasaki, JP;
Tsutomu Karimata, Yokohama, JP;
Kenji Watanabe, Fujisawa, JP;
Nobuharu Noji, Zushi, JP;
Takeshi Murakami, Tokyo, JP;
Masahiro Hatakeyama, Fujisawa, JP;
Mamoru Nakasuji, Yokohama, JP;
Hirosi Sobukawa, Zama, JP;
Shoji Yoshikawa, Hachioji, JP;
Shin Oowada, Yokohama, JP;
Mutsumi Saito, Yokohama, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A substrate inspection apparatus-(FIG.) of the present invention performs the following steps of: carrying a substrate 'S' to be inspected into an inspection chamber-; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage-with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system-; trapping secondary electrons emitted from said substrate via a secondary electron optical system-and guiding it to a detecting system-; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU-; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.