The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Mar. 03, 2004
Shih-ming Chang, Hsinchu, TW;
Chung-hsing Chang, Hsin-Chu, TW;
Chih-cheng Chin, Taipei, TW;
Wen-chuan Wang, Hsin-Chu, TW;
Chi-lun LU, Hsin-Chu, TW;
Sheng-chi Chin, Hsin-Chu, TW;
Chin-hsiang Lin, Hsin-Chu, TW;
Shih-Ming Chang, Hsinchu, TW;
Chung-Hsing Chang, Hsin-Chu, TW;
Chih-Cheng Chin, Taipei, TW;
Wen-Chuan Wang, Hsin-Chu, TW;
Chi-Lun Lu, Hsin-Chu, TW;
Sheng-Chi Chin, Hsin-Chu, TW;
Chin-Hsiang Lin, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A hologram reticle and method of patterning a target. A layout pattern for an image to be transferred to a target is converted into a holographic representation of the image. A hologram reticle is manufactured that includes the holographic representation. The hologram reticle is then used to pattern the target. Three-dimensional patterns may be formed in a photoresist layer of the target in a single patterning step. These three-dimensional patterns may be filled to form three-dimensional structures. The holographic representation of the image may also be transferred to a top photoresist layer of a top surface imaging (TSI) semiconductor device, either directly or using the hologram reticle. The top photoresist layer may then be used to pattern an underlying photoresist layer with the image. The lower photoresist layer is used to pattern a material layer of the device.