The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2007
Filed:
Aug. 29, 2005
Peter Nunan, Monte Sereno, CA (US);
Muhran Nasser-ghodsi, Hamilton, MA (US);
Mark Borowicz, San Jose, CA (US);
Rudy F. Garcia, Union City, CA (US);
Tzu Chin Chuang, Cupertino, CA (US);
Herschel Marchman, San Jose, CA (US);
David Soltz, San Jose, CA (US);
Peter Nunan, Monte Sereno, CA (US);
Muhran Nasser-Ghodsi, Hamilton, MA (US);
Mark Borowicz, San Jose, CA (US);
Rudy F. Garcia, Union City, CA (US);
Tzu Chin Chuang, Cupertino, CA (US);
Herschel Marchman, San Jose, CA (US);
David Soltz, San Jose, CA (US);
KLA-Tencor Technologies Corp., Milpitas, CA (US);
Abstract
Various systems configured to reduce distortion of a resist during a metrology process are provided. The systems include an electron beam metrology tool configured to measure one or more characteristics of one or more resist features formed on a specimen. The electron beam metrology tool may be configured as a scanning electron microscope. The resist may be designed for exposure at a wavelength of about 193 nm. One system includes a cooling subsystem configured to alter a temperature of the specimen during measurements by the tool such that the resist feature(s) are not substantially distorted during the measurements. Another system includes a drying subsystem that is configured to reduce moisture proximate the specimen during measurements by the electron beam metrology tool such that the resist feature(s) are not substantially distorted during the measurements. An additional system may include both the cooling subsystem and the drying subsystem.