The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Nov. 16, 2000
Steven T. Mayer, Portland, OR (US);
Vijay Bhaskaran, Beaverton, OR (US);
Evan E. Patton, Portland, OR (US);
Robert L. Jackson, Lake Oswego, OR (US);
Jonathan Reid, Sherwood, OR (US);
Steven T. Mayer, Portland, OR (US);
Vijay Bhaskaran, Beaverton, OR (US);
Evan E. Patton, Portland, OR (US);
Robert L. Jackson, Lake Oswego, OR (US);
Jonathan Reid, Sherwood, OR (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.