The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Mar. 14, 2001
Hiroshi Morioka, Ebina, JP;
Minori Noguchi, Yokohama, JP;
Yoshimasa Ohshima, Yokohama, JP;
Yukio Kembo, Yokohama, JP;
Hidetoshi Nishiyama, Fujisawa, JP;
Kazuhiko Matsuoka, Gunma-ken, JP;
Yoshiharu Shigyo, Takasaki, JP;
Hiroshi Morioka, Ebina, JP;
Minori Noguchi, Yokohama, JP;
Yoshimasa Ohshima, Yokohama, JP;
Yukio Kembo, Yokohama, JP;
Hidetoshi Nishiyama, Fujisawa, JP;
Kazuhiko Matsuoka, Gunma-ken, JP;
Yoshiharu Shigyo, Takasaki, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A processing method for semiconductor devices in a semiconductor fabrication line includes processing a substrate in a first processing apparatus, transferring the substrate processed in the first processing apparatus to a detecting apparatus without removal of the substrate from the semiconductor fabrication line while continuing fabrication of the semiconductor devices, detecting foreign particle defects on the substrate transferred to the detecting apparatus, and determining a foreign particle generation condition of the processing apparatus based on a data from the detecting.