The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2005
Filed:
Jun. 05, 2003
Stephen D. Coomer, Tempe, AZ (US);
John Francis Mcintee, Gold Canyon, AZ (US);
Jozsef Michael Iha, Gold Canyon, AZ (US);
Robert T. Borra, Austin, TX (US);
Eric Lusby, Mesa, AZ (US);
Michael J. Lombardi, Phoenix, AZ (US);
Stephen D. Coomer, Tempe, AZ (US);
John Francis McIntee, Gold Canyon, AZ (US);
Jozsef Michael Iha, Gold Canyon, AZ (US);
Robert T. Borra, Austin, TX (US);
Eric Lusby, Mesa, AZ (US);
Michael J. Lombardi, Phoenix, AZ (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
Apparatus and methods for a wafer handling system that manipulates semiconductor wafers. The invention includes an end effector having a vacuum chuck, an internal vacuum plenum, and flow diverters positioned within the vacuum plenum that define vacuum distribution channels coupled in fluid communication with vacuum ports of the vacuum chuck. The invention also includes a vacuum chuck having flow diverters positioned in one or more internal vacuum plenums that are in fluid communication with the vacuum ports of the vacuum chuck. The flow diverters adjust the vacuum pressure supplied to the vacuum ports such that, as vacuum ports are occluded by the wafer, the vacuum pressure is preferentially applied to unblocked vacuum ports for increasing the attractive force applied to unengaged portions of the wafer. The apparatus of the present invention has particularly utility for securing thin semiconductor wafers with a significant warpage.