The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6856155 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 15, 2005

Filed:

Oct. 07, 2002
Applicants:

Wuu Yean Tay, Singapore, SG;

Yong Kian Tan, Singapore, SG;

Yong Poo Chia, Singapore, SG;

Siu Waf Low, Singapore, SG;

Suan Jeung Boon, Singapore, SG;

Soon Huat Goh, Singapore, SG;

Inventors:

Wuu Yean Tay, Singapore, SG;

Yong Kian Tan, Singapore, SG;

Yong Poo Chia, Singapore, SG;

Siu Waf Low, Singapore, SG;

Suan Jeung Boon, Singapore, SG;

Soon Huat Goh, Singapore, SG;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R031/02 ;
U.S. Cl.
CPC ...
Abstract

A testing scheme for ball-grid array devices of different sizes where the same ball-grid pattern may be tested using the same set of test adapters. A testing scheme includes providing a plurality of devices having a predetermined pattern of solder balls attached, providing a plurality of adapters secured to a test board, each of the adapters including a plurality of test contacts arranged in a pattern corresponding to the predetermined pattern of solder balls, removably attaching the plurality of devices to a device holding apparatus such that the predetermined pattern of solder balls on the devices corresponds to the predetermined pattern of test contacts on the plurality of adapters, then positioning the device holding apparatus to bring the plurality of solder balls in contact with the plurality of test contacts.


Find Patent Forward Citations

Tay, Wuu. (2005). Methods and apparatus for testing and burn-in of semiconductor devices (U.S. Patent No. 6856155). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6856155

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