The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
Aug. 27, 2002
Jonathan D. Reid, Sherwood, OR (US);
Timothy Mark Archer, Lake Oswego, OR (US);
Thomas Tan Vu, San Jose, CA (US);
Seshasayee Varadarajan, Wilsonville, OR (US);
Jon Henri, West Linn, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
David Sauer, Tigard, OR (US);
Anita Kang, Portland, OR (US);
Gerald Feldewerth, Beaverton, OR (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
An electroplating system includes (a) a phosphorized anode having an average grain size of at least about 50 micrometers and (b) plating apparatus that separates the anode from the cathode and prevents most particles generated at the anode from passing to the cathode. The separation may be accomplished by interposing a microporous chemical transport barrier between the anode and cathode. The relatively few particles that are generated at the large grain phosphorized copper anode are prevented from passing into the cathode (wafer) chamber area and thereby causing a defect in the part.