The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2004
Filed:
Mar. 12, 2002
Edwin C. Weldon, Los Gatos, CA (US);
Kenneth S. Collins, San Jose, CA (US);
Arik Donde, Cupertino, CA (US);
Brian Lue, Mountain View, CA (US);
Dan Maydan, Los Altos Hills, CA (US);
Robert J. Steger, Cupertino, CA (US);
Timothy Dyer, Tempe, AZ (US);
Ananda H. Kumar, Milpitas, CA (US);
Alexander M. Veytser, Mountain View, CA (US);
Kadthala R. Narendrnath, San Jose, CA (US);
Semyon L. Kats, San Francisco, CA (US);
Arnold Kholodenko, San Francisco, CA (US);
Shamouil Shamouilian, San Jose, CA (US);
Dennis S. Grimard, Ann Arbor, MI (US);
Applied Materials Inc., Santa Clara, CA (US);
Abstract
An electrostatic chuck has an electrode capable of being electrically charged to electrostatically hold a substrate. A composite layer covers the electrode. The composite layer comprises (1) a first dielectric material covering a central portion of the electrode, and (2) a second dielectric material covering a peripheral portion of the electrode, the second dielectric material having a different composition than the composition of the first dielectric material. The chuck is useful in a plasma process chamber to process substrates, such as semiconductor wafers.