The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Jun. 07, 2002
Li-Chen Chen, Taipei, TW;
Chia-Tsun Hsu, Sanchung, TW;
Chia-Fu Lin, Hsin-chu, TW;
Kuo-Ching Lee, Tainan, TW;
Yen-Ming Chen, Hsin-chu, TW;
Kai-Ming Ching, Taiping, TW;
Hsin-Hui Lee, Kaoshingh, TW;
Chao-Yuan Su, Koahsiang, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Abstract
A DFR laminating and PET removing system which is capable of both laminating a dry film resist (DFR) layer on a semiconductor wafer and removing a DFR support film such as polyethylene terepthalate (PET) from the DFR layer on the wafer at a single location. The DFR laminating and PET removing system of the present invention comprises a PET support film removing head for removing a portion of PET film from the semiconductor wafer substrate after the PET film portion and dry film resist (DFR) portion are laminated from a DFR tape onto the wafer and before the DFR portion is cut from the DFR tape.