This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Kuo-Ching Lee: Innovator in Semiconductor Technology
Introduction
Kuo-Ching Lee is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to laminating and film removal systems.
Latest Patents
Kuo-Ching Lee holds a patent for a DFR laminating and film removing system. This invention is designed to laminate a dry film resist (DFR) layer on a semiconductor wafer while simultaneously removing a DFR support film, such as polyethylene terephthalate (PET), from the DFR layer at a single location. The system includes a PET support film removing head that efficiently removes a portion of the PET film from the semiconductor wafer substrate after the two layers are laminated.
Career Highlights
Kuo-Ching Lee is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the processes involved in semiconductor manufacturing.
Collaborations
He has collaborated with notable colleagues, including Li-Chen Chen and Chia-Tsun Hsu, contributing to various projects within the semiconductor field.
Conclusion
Kuo-Ching Lee's innovative work in semiconductor technology, particularly his patent for the DFR laminating and film removing system, showcases his expertise and commitment to advancing the industry. His contributions continue to influence the field significantly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile