The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2003
Filed:
Mar. 09, 2001
Applicant:
Inventors:
Kin Pui Kwan, Kowloon, HK;
Wing Him Lau, Yuen Long, HK;
Kwok Cheung Tsang, Fauling, HK;
Chun Ho Fan, Shamtseng, HK;
Neil Mclellan, Branksom, HK;
Assignee:
ASAT Ltd., Tsuen Wan, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/352 ; H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/352 ; H01L 2/328 ;
Abstract
A leadless plastic chip carrier has a plurality of die attach pads on which a singulated semi-conductor die is mounted. At least one row of contact pads circumscribes the plurality of die attach pads and a power/ground ring is intermediate the contact pads and the die attach pads. Wire bonds connect the semiconductor die, the contact pads and the power/ground ring. An overmold covers the semiconductor die, the die attach pads, the power/ground ring and the contact pads such that each of the die attach pads and the contact pads has one exposed surface.