The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2003
Filed:
Sep. 18, 2000
Takayuki Niuya, Tokyo-To, JP;
Michihiro Ono, Farrer Drive, SG;
Hideto Goto, Tokyo-To, JP;
Kyungho Park, Nirasaki, JP;
Yoshinori Marumo, Nirasaki, JP;
Katsusuke Shimizu, Tokyo-To, JP;
Tokyo Electron Ltd., Tokyo-To, JP;
Abstract
The object of the present invention is to provide a plating method capable of planarization process of high quality in comparison with the conventional plating method and also provide a plating device and a plating system adopting the plating method of the invention. In the plating method and device, an object to be processed and an electrode plate are dipped in a solution including objective metal ions and a forward current is supplied between the object and the electrode plate to educe a metal on the surface of the object. After forming a plating film on the object excessively, a backward current is supplied between the object and the electrode to uniformly remove at least part of superfluous plating film.