The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2003
Filed:
Jun. 07, 2000
WonSun Shin, KyungKi-Do, KR;
SeonGoo Lee, KyungKi-Do, KR;
TaeHoan Jang, Seoul, KR;
DoSung Chun, Chacheongsao, TH;
Vincent DiCaprio, Mesa, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A circuit board for semiconductor packages capable of fabricating a large number of semiconductor packages in a single circuit board, the circuit board including: a resin layer in the form of a rectangular sheet with first and second sides, the resin layer having a plurality of through holes arranged in rows and columns sharing a sub slot of a predetermined length as a common boundary to form one sub strip for mounting a semiconductor chip, a plurality of the sub strips being arranged in a row and sharing a main slot of a predetermined length as a common boundary to form one main strip; a plurality of circuit patterns each formed in the resin layer between the through hole of the individual sub strip and the sub slot; and a cover coat coated on the resin layer for the purpose of protecting the circuit patterns against external environments.