Company Filing History:
Years Active: 2002-2006
Title: Innovations of SeonGoo Lee in Semiconductor Technology
Introduction
SeonGoo Lee is a prominent inventor based in Kyungki-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative packaging solutions that enhance the performance and efficiency of semiconductor devices.
Latest Patents
One of SeonGoo Lee's latest patents is for a stackable semiconductor package that features a semiconductor chip positioned within a central through hole of the substrate. This design includes a substrate with a first surface, an opposite second surface, and a through hole. The circuit patterns on both surfaces incorporate lands, while the second surface also features bond fingers. The semiconductor chip is located in the through hole, with bond pads oriented in the same direction as the substrate's second surface. Wires connect the bond pads to the bond fingers, and an encapsulant fills the through hole, covering the chip, wires, and bond fingers without obscuring the lands. Additionally, conductive balls are fused to the lands on the first surface, allowing for stacking of a second semiconductor package on the substrate's second surface.
Another notable patent involves a semiconductor package and its manufacturing method. This package consists of a semiconductor chip, a circuit board, electrical connection means, encapsulation material, and multiple conductive balls. The semiconductor chip has both a first and second surface, with input and output pads formed on one of these surfaces. The circuit board is a thin film with a center hole for the semiconductor chip, featuring circuit patterns that include bond fingers and ball lands. The electric connection means link the chip's pads to the circuit board's bond fingers, while the encapsulation material covers the semiconductor and connection means. Conductive balls are fusion-welded onto the ball lands of the circuit board.
Career Highlights
SeonGoo Lee is currently employed at Amkor Technology, Inc., where he continues to innovate in semiconductor packaging. His work has significantly impacted the efficiency and functionality of semiconductor devices, making him a valuable asset to the company.
Collaborations
SeonGoo Lee collaborates with talented coworkers, including WonSun Shin and DoSung Chun. Their combined expertise contributes to the advancement of semiconductor technology and the development of innovative solutions.
Conclusion
SeonGoo Lee's contributions to semiconductor technology through