Location History:
- The Kingdom of Thailand, TH (2002)
- Chacheongsao, TH (2002 - 2004)
- Tempe, AZ (US) (2006)
Company Filing History:
Years Active: 2002-2006
Title: DoSung Chun: Innovator in Semiconductor Packaging
Introduction
DoSung Chun is a prominent inventor based in Chachoengsao, Thailand. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on innovative designs that enhance the efficiency and functionality of semiconductor devices.
Latest Patents
One of his latest patents is for a stackable semiconductor package that features a semiconductor chip positioned within a central through hole of the substrate. This design includes a substrate with a first surface, an opposite second surface, and a through hole. The circuit patterns on both surfaces incorporate lands, while the second surface also features bond fingers. The semiconductor chip is placed in the through hole, with bond pads oriented in the same direction as the substrate's second surface. Wires connect the bond pads to the bond fingers, and an encapsulant fills the through hole, covering the chip, wires, and bond fingers without obscuring the lands. Additionally, conductive balls are fused to the lands on the first surface, allowing for stacking of a second semiconductor package on the substrate's second surface.
Another notable patent involves a semiconductor package and its manufacturing method. This package consists of a semiconductor chip, a circuit board, electrical connection means, encapsulation material, and multiple conductive balls. The semiconductor chip has input and output pads on one of its surfaces. The circuit board is a thin film with a center hole for the chip, featuring circuit patterns that include bond fingers and ball lands. The electrical connection means links the chip's pads to the bond fingers, while the encapsulation material covers the chip and connections. Conductive balls are fusion-welded onto the ball lands of the circuit board.
Career Highlights
DoSung Chun is currently employed at Amkor Technology, Inc., where he continues to innovate in semiconductor packaging technologies. His work has significantly impacted the efficiency and design of semiconductor devices, making them more compact and effective.
Collaborations
Throughout his career, DoSung Chun has collaborated with notable colleagues, including WonSun Shin and SeonGoo Lee. These partnerships have fostered a creative environment that has led to groundbreaking advancements in semiconductor technology.
Conclusion
DoSung Chun's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of technology and