Company Filing History:
Years Active: 2002-2006
Title: Innovations of WonSun Shin in Semiconductor Packaging
Introduction
WonSun Shin is a prominent inventor based in Kyungki-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Among his latest innovations is a stackable semiconductor package that features a semiconductor chip positioned within a central through hole of the substrate. This design includes circuit patterns on both surfaces of the substrate, with bond fingers and lands that facilitate electrical connections. The semiconductor chip is connected to these patterns through wires, and an encapsulant secures the components while leaving the lands exposed for further connections. Another notable patent involves a semiconductor package and its manufacturing method, which incorporates a semiconductor chip, a circuit board, and conductive balls for effective electrical connections. This design aims to improve the overall performance and reliability of semiconductor packages.
Career Highlights
WonSun Shin is currently employed at Amkor Technology, Inc., where he continues to innovate in semiconductor technology. His expertise and dedication have positioned him as a key player in the industry, contributing to advancements that benefit various applications.
Collaborations
He has collaborated with notable coworkers, including DoSung Chun and SeonGoo Lee, to further enhance the development of semiconductor technologies.
Conclusion
WonSun Shin's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.