The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
May. 10, 1999
Hideto Gotoh, Ibaraki-ken, JP;
Tsuyoshi Matsui, Ibaraki-ken, JP;
Takayuki Niuya, Ibaraki-ken, JP;
Tetsuo Aoyama, Niigata-ken, JP;
Taketo Maruyama, Niigata-ken, JP;
Tetsuya Karita, Niigata-ken, JP;
Kojiro Abe, Niigata-ken, JP;
Fukusaburou Ishihara, Ibaraki-ken, JP;
Ryuji Sotoaka, Ibaraki-ken, JP;
Other;
Abstract
A cleaning agent for use in producing semiconductor devices. The cleaning agent is an aqueous solution containing (A) a fluorine-containing compound, (B) a salt of boric acid, (C) a water-soluble organic solvent, and optionally, (D) a specific quaternary ammonium salt or (D′) a specific ammonium salt of an organic carboxylic acid or a specific amine salt of an organic carboxylic acid. The polymeric deposit inside and around the via holes and on the side wall of the conductive line pattern formed during the dry etching process can be effectively removed by using the cleaning agent without affecting the dimensions of the via holes and the conductive line pattern.