The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2001

Filed:

Jul. 18, 2000
Applicant:
Inventors:

Yakub Aliyu, Singapore, SG;

Simon Chooi, Singapore, SG;

Mei Sheng Zhou, Singapore, SG;

John Leonard Sudijono, Singapore, SG;

Subhash Gupta, Singapore, SG;

Sudipto Ranendra Roy, Singapore, SG;

Paul Kwok Keung Ho, Singapore, SG;

Yi Xu, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

An effective copper decontamination method in the fabrication of integrated circuits is achieved. An organic-based HFACAC decontamination compound in vapor phase is sprayed over elemental copper found on equipment or tools or as a spill wherein the compound reacts with all of the elemental copper and forms a volatile compound that can be flushed away thereby completing copper decontamination.


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Aliyu, Yakub. (2001). Application of vapor phase hfacac-based compound for use in copper decontamination and cleaning processes (U.S. Patent No. 6261955). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6261955

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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