The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2001

Filed:

Jul. 28, 1999
Applicant:
Inventors:

Kazuhiro Kubota, Nakakoma-gun, JP;

Shigeki Tozawa, Nirasaki, JP;

Jun Hirose, Nakakoma-gun, JP;

Akira Koshiishi, Kofu, JP;

Tomomi Kondo, Fukuyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/000 ; C23F 1/02 ; C23C 1/600 ; H01L 2/100 ;
U.S. Cl.
CPC ...
B23K 1/000 ; C23F 1/02 ; C23C 1/600 ; H01L 2/100 ;
Abstract

The magnetron plasma processing apparatus includes a vacuum chamber in which a semiconductor wafer is accommodated. In the chamber, a pair of electrodes are provided to face each other, and the wafer is placed on one electrode. Between a pair of the electrodes, a vertical electric field is formed, and a horizontal magnetic field is formed by the dipole ring magnet to cross perpendicularly to the electric field. The magnetic field has a gradient of the magnetic field intensity such that the intensity is high on the upstream side and is low on the downstream side in the electron-drift direction. Further, the magnetic field is formed such that the intensity is made uniform over a large area including the end portion of the wafer on the upstream side in the electron-drift direction and a region right outside it.


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