The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2000
Filed:
Oct. 09, 1998
Daniel George Berger, Wappingers Falls, NY (US);
Guy Paul Brouillette, Quebec, CA;
David Hirsch Danovitch, Quebec, CA;
Peter Alfred Gruber, Mohegan Lake, NY (US);
Rajesh Shankerlal Patel, Fremont, CA (US);
Stephen Roux, Purdys, NY (US);
Carlos Juan Sambucetti, Croton-on-Hudson, NY (US);
James Louis Speidell, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.