The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 1995
Filed:
Jul. 20, 1993
Nobuo Konishi, Kofu, JP;
Hideyuki Takamori, Kumamoto, JP;
Masami Akimoto, Kumamoto, JP;
Kiyohisa Tateyama, Kumamoto, JP;
Masaaki Murakami, Kumamoto, JP;
Norimitsu Morioka, Kumamoto, JP;
Takashi Takekuma, Yamaga, JP;
Tokyo Electron Limited, Tokyo, JP;
Tokyo Electron Kyushu Limited, Tosu, JP;
Abstract
A substrate solution-processing method comprising the steps of preparing a pair of spin chucks by which semiconductor wafers are supported, a housing by which the wafers supported by the spin chucks are enclosed, motor for rotating the spin chucks, a nozzle through which developing or resist solution is applied to each wafer, means for moving the nozzle between the wafers, and a waiting trench at which the nozzle is kept waiting, setting substantially same the times needed to finish the cycles of processing the wafers supported on at least two spin chucks and delaying one process cycle from the other, and keeping the nozzle waiting at the waiting trench unless developing or resist solution is applied to each wafer through the nozzle.