The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 1995
Filed:
Jun. 17, 1993
Yutaka Shimada, Sagamihara, JP;
Hitoshi Kato, Kofu, JP;
Junichi Kakizaki, Fujisawa, JP;
Kazutugu Aoki, Shiroyama, JP;
Haruki Mori, Yokosuka, JP;
Tatsuo Shiotsuki, Ooita, JP;
Tokyo Electron Limited, Tokyo, JP;
Tokyo Electron Tohoku Limited, Esashi, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A substrate processing apparatus comprising a process tube for enclosing a plurality of semiconductor wafers, injectors for introducing process gas into the process tube, a vacuum pump for exhausting the process tube, RF electrodes arranged along the outer circumference of the process tube and serving to generate high frequency electric field, when power is supplied, in a process-gas-introduced region so as to make process gas into plasmas, a high frequency power source for supplying power to the RF electrodes, heaters arranged in the process tube to directly heat the plural wafers, a power supply for supplying power to the heaters, and a controller for controlling the amount of power supplied from the power supply to the heaters.