The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Mar. 28, 2025
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Toshiki Akama, Miyagi, JP;

Shusei Kato, Miyagi, JP;

Gyeong Min Park, Miyagi, JP;

Nobutaka Sasaki, Miyagi, JP;

Takashi Aramaki, Miyagi, JP;

Lifu Li, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/20 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32697 (2013.01); H01J 37/32449 (2013.01); H01J 37/32642 (2013.01); H01J 37/32834 (2013.01); H01J 37/32853 (2013.01); H01J 2237/334 (2013.01);
Abstract

A substrate processing system comprising: a plasma processing apparatus; a depressurization transfer device having a transfer robot and an edge ring; and a controller is disclosed. The plasma processing apparatus includes: a depressurizable processing chamber; a substrate support table; a lifting mechanism; a gas supply part; and a plasma generating part. The controller controls following steps to be performed in following order: (a) performing plasma processing on the substrate and, then, applying a voltage of a first polarity to the electrode; (b) neutralizing the edge ring, by applying a voltage of a second polarity to the electrode while supplying a gas, and stopping the application of the voltage to the electrode after a predetermined period of time elapses; (c) separating the edge ring from a ring placing surface of the substrate support table; and (d) transferring the edge ring from the processing chamber to the depressurization pressure transfer device.


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Akama, Toshiki. (2026). Substrate treatment system (U.S. Patent No. 12776479). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12776479

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