The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Aug. 16, 2023
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Cheng-Ming Yu, Taichung City, TW;
Jhen-Hong Lin, Hsinchu, TW;
Mochtar Chandra, Hsinchu City, TW;
Wei-Fen Pai, Hsinchu, TW;
Li-Chun Hung, Hsinchu, TW;
Yen-Ming Chen, Chu-Pei City, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A silicon interconnect die includes through-substrate via (TSV) structures extending through a silicon substrate; an insulating spacer layer including a horizontally-extending portion overlying a top surface of the silicon substrate and a plurality of tubular insulating material portions laterally surrounding a respective one of the TSV structures; and a front metallic shield layer including a horizontally-extending metallic shield portion and at least one tubular metallic shield portion laterally surrounding a respective one of the tubular insulating material portions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile