This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Cheng-Ming Yu: Semiconductor Interconnect Invention
Introduction
Cheng-Ming Yu is an inventor associated with Taichung, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work concerns silicon interconnect technology and through-substrate vias.
Latest Patents
Yu is credited with 1 patent: “Shielded Through-Substrate Via Structures for Silicon Interconnect Die.” The invention describes through-substrate via structures extending through a silicon substrate. It includes an insulating spacer layer with tubular portions surrounding the vias and a metallic shield layer with tubular portions surrounding the insulating material. These structures are designed to provide shielding around the vias in a silicon interconnect die.
Career Highlights
Yu’s listed patent reflects work on semiconductor interconnect structures at Taiwan Semiconductor Manufacturing Company Limited. The patent focuses on integrating insulating and metallic shielding features around through-substrate vias.
Collaborations
Yu’s listed coworkers include Jhen-Hong Lin and Mochtar Chandra. Their names are associated with his patent-related work.
Conclusion
Cheng-Ming Yu’s patent highlights his contribution to silicon interconnect technology through shielded through-substrate via structures.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile