This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Mochtar Chandra: Semiconductor Interconnect Innovation.
Introduction
Mochtar Chandra is an inventor associated with Hsinchu, Taiwan. His patent work concerns silicon interconnect technology and through-substrate vias.
Latest Patents
Chandra is associated with one patent, 1 patent: “Shielded Through-Substrate Via Structures for Silicon Interconnect Die.” The invention describes a silicon interconnect die with through-substrate via (TSV) structures extending through a silicon substrate. Insulating material surrounds each TSV, while a metallic shield layer includes portions that laterally surround the insulating spacers.
Career Highlights
Chandra is associated with Taiwan Semiconductor Manufacturing Company, Ltd. His patent focuses on shielding and insulating TSV structures, components used in silicon interconnect dies.
Collaborations
The provided information identifies Cheng-Ming Yu and Jhen-Hong Lin as Chandra’s coworkers. The patent description also reflects work in semiconductor interconnect design.
Conclusion
Mochtar Chandra’s documented patent contribution addresses shielded through-substrate vias for silicon interconnect dies, highlighting a specialized area of semiconductor innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile