The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Jul. 09, 2024
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chiao-Hua Cheng, Tainan City, TW;
Sheng-Kang Yu, Hsinchu City, TW;
Shang-Chieh Chien, New Taipei City, TW;
Wei-Chun Yen, Tainan City, TW;
Heng-Hsin Liu, New Taipei City, TW;
Ming-Hsun Tsai, Hsinchu City, TW;
Yu-Fa Lo, Kaohsiung, TW;
Li-Jui Chen, Hsinchu City, TW;
Wei-Shin Cheng, Hsinchu City, TW;
Cheng-Hsuan Wu, New Taipei City, TW;
Cheng-Hao Lai, Taichung City, TW;
Yu-Kuang Sun, Hsinchu City, TW;
Yu-Huan Chen, Hsinchu City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of inspecting an extreme ultraviolet (EUV) radiation source includes, in an idle mode, inserting a borescope mounted on a fixture through a first opening into a chamber of the EUV radiation source. The borescope includes a connection cable attached at a first end to a camera. The EUV radiation source includes an excitation laser that generates a light beam that is configured to focus onto tin droplets to generate EUV radiation inside the chamber of the EUV radiation source. The method further includes extending the extendible section, in a direction toward the second opening of the EUV radiation source, to move the camera beyond the blocking shield, and acquiring one or more images from a region beyond the blocking shield. The method also includes analyzing the one or more acquired images to determine an amount of tin debris deposited inside the chamber of the EUV radiation source.