The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Sep. 01, 2022
Applicant:

Wonik Ips Co., Ltd., Pyeongtaek-si Gyeonggi-do, KR;

Inventors:

Tae Dong Kim, Osan-si Gyeonggi-do, KR;

Jung Hwan Lee, Osan-si Gyeonggi-do, KR;

Cheong Hwan Jeong, Anseong-si Gyeonggi-do, KR;

Sung Ho Roh, Yongin-si Gyeonggi-do, KR;

Young Jun Kim, Pyeongtaek-si Gyeonggi-do, KR;

Moon Chul Kum, Gwangmyeong-si Gyeonggi-do, KR;

Chan Soo Park, Osan-si Gyeonggi-do, KR;

Mi Sook Kim, Yongin-si Gyeonggi-do, KR;

Yong Ki Kim, Hwaseong-si Gyeonggi-do, KR;

Assignee:

WONIK IPS CO., LTD., Pyeongtaek-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/40 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45557 (2013.01); C23C 16/4412 (2013.01); C23C 16/45563 (2013.01); C23C 16/4586 (2013.01);
Abstract

The present invention disclosed herein relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus in which a substrate is processed at a high pressure and a low pressure. The present invention discloses a substrate processing apparatus including: a process chamber () which has an inner space and in which an installation groove () is defined at a central side on a bottom surface (); a substrate support () installed to be inserted into the installation groove () and having a top surface on which the substrate is seated; an inner lid part () which is installed to be movable vertically in the inner space and descends so that a portion thereof is in close contact with the bottom surface () adjacent to the installation groove () to define a sealed processing space (S) in which the substrate support () is disposed therein.


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