The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Mar. 16, 2023
Applicant:

Ims Nanofabrication Gmbh, Brunn am Gebirge, AT;

Inventors:

Matthias Liertzer, Hinterbrühl, AT;

Christoph Spengler, Vienna, AT;

Wolf Naetar, Vienna, AT;

Elmar Platzgummer, Vienna, AT;

Assignee:

IMS Nanofabrication GmbH, Brunn am Gebirge, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/302 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/7055 (2013.01); G03F 7/70891 (2013.01); H01J 37/3026 (2013.01); H01J 2237/30461 (2013.01);
Abstract

A pattern writing method for charged-particle lithography apparatuses using an improved correction for thermal distortion of the substrate includes determining an exposure position where the beam impinges on the substrate and the power of the beam at the exposure position; calculating heating of the substrate at the exposure position, and calculating, for a plurality of locations over the substrate, and the thermal diffusion and radiative cooling; calculating, for the same or a reduced plurality of locations on the substrate, the positional change of the substrate due to thermal expansion; determining a displacement distance which compensates the positional change at the exposure position, updating the structure to be written by shifting the exposure position of the beam by said displacement distance, and writing the updated structures on the substrate with the beam. These steps are repeated as a function of time and/or varying exposure position of the beam substrate position.


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