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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12622250 B1

PDFFull Text
Date of Patent:
May. 05, 2026

Filed:

Mar. 31, 2022

Vias with vertically non-uniform or discontinuous stack

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Payam Amin, Portland, OR (US);

Tofizur Rahman, Portland, OR (US);

Bozidar Marinkovic, Portland, OR (US);

Santhosh Kumar Koduri, Portland, OR (US);

Tugba Koker Aykol, Beaverton, OR (US);

Jayeeta Sen, Beaverton, OR (US);

David Bennett, Portland, OR (US);

Conor P. Puls, Portland, OR (US);

Clay Mortensen, Portland, OR (US);

Leslie L. Chan, Portland, OR (US);

Hoang Doan, Beaverton, OR (US);

Dolly Natalia Ruiz Amador, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Tong-Ho Kim

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/76898 (2013.01); H01L 23/5283 (2013.01); H01L 23/53257 (2013.01); H10D 30/43 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01);
Abstract

Embodiments disclosed herein include a via structure and methods of forming the via structure. In an embodiment, the via structure comprises a substrate and an opening through the substrate. In an embodiment, the opening has a first portion and a second portion under the first portion. In an embodiment, the via structure further comprises a lining on sidewalls of the first portion of the opening, and a via filling the opening. In an embodiment, the via has a first region with a first width and a second region with a second width, wherein the first width is smaller than the second width.

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