This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Bozidar Marinkovic: Innovator in Via Structures
Introduction
Bozidar Marinkovic is a notable inventor based in Portland, Oregon. He has made significant contributions to the field of semiconductor technology, particularly in the design and formation of via structures.
Latest Patents
Marinkovic holds a patent for "Vias with vertically non-uniform or discontinuous stack." This patent describes a via structure that includes a substrate and an opening through the substrate. The opening consists of a first portion and a second portion beneath it. Additionally, the via structure features a lining on the sidewalls of the first portion and a filling that occupies the opening. Notably, the via has regions of varying widths, with the first width being smaller than the second.
Career Highlights
Bozidar Marinkovic is currently employed at Intel Corporation, where he applies his expertise in semiconductor innovations. His work focuses on enhancing the efficiency and performance of electronic components through advanced via structures.
Collaborations
Throughout his career, Marinkovic has collaborated with talented professionals, including Payam Amin and Tofizur Rahman. These collaborations have contributed to the advancement of technology in their respective fields.
Conclusion
Bozidar Marinkovic is a distinguished inventor whose work on via structures has the potential to impact the semiconductor industry significantly. His innovative approach continues to inspire advancements in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
