Portland, OR, United States of America

Leslie L Chan

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Leslie L Chan

Introduction

Leslie L Chan is an accomplished inventor based in Portland, OR (US). She has made significant contributions to the field of technology, particularly in the area of via structures. Her innovative work has led to the development of a unique patent that showcases her expertise and creativity.

Latest Patents

Leslie holds a patent for "Vias with vertically non-uniform or discontinuous stack." This patent includes embodiments that describe a via structure and methods for forming it. The via structure comprises a substrate with an opening that has a first portion and a second portion beneath it. Additionally, the structure features a lining on the sidewalls of the first portion and a via that fills the opening. Notably, the via has regions of varying widths, with the first width being smaller than the second width. Leslie has 1 patent to her name.

Career Highlights

Leslie is currently employed at Intel Corporation, where she continues to push the boundaries of innovation. Her work at Intel has allowed her to collaborate with some of the brightest minds in the industry, contributing to advancements in technology.

Collaborations

Leslie has worked alongside talented colleagues, including Payam Amin and Tofizur Rahman. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Leslie L Chan is a remarkable inventor whose contributions to the field of technology are noteworthy. Her patent on via structures exemplifies her innovative spirit and dedication to advancing the industry.

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