This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hoang Doan: Innovator in Via Structures
Introduction
Hoang Doan is a notable inventor based in Beaverton, Oregon. He has made significant contributions to the field of semiconductor technology, particularly in the design and formation of via structures.
Latest Patents
Hoang Doan holds 1 patent for his invention titled "Vias with vertically non-uniform or discontinuous stack." This patent discloses embodiments that include a via structure and methods of forming the via structure. The via structure comprises a substrate with an opening that has a first portion and a second portion beneath it. Additionally, the via structure features a lining on the sidewalls of the first portion and a filling that occupies the opening. Notably, the via has regions of varying widths, with the first width being smaller than the second.
Career Highlights
Hoang Doan is currently employed at Intel Corporation, where he applies his expertise in semiconductor technologies. His work focuses on enhancing the efficiency and performance of electronic components through innovative designs.
Collaborations
Throughout his career, Hoang has collaborated with talented individuals such as Payam Amin and Tofizur Rahman. These collaborations have contributed to the advancement of technology in their respective fields.
Conclusion
Hoang Doan is a distinguished inventor whose work in via structures has the potential to impact the semiconductor industry significantly. His innovative approach and collaboration with other experts highlight his commitment to advancing technology.