This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: David Bennett - Innovator in Via Structures
Introduction
David Bennett is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of semiconductor technology, particularly in the design and formation of via structures.
Latest Patents
David holds 1 patent for his invention titled "Vias with vertically non-uniform or discontinuous stack." This patent discloses embodiments that include a via structure and methods of forming the via structure. The via structure comprises a substrate with an opening that has a first portion and a second portion beneath it. Additionally, the structure features a lining on the sidewalls of the first portion and a via that fills the opening. Notably, the via has a first region with a smaller width and a second region with a larger width.
Career Highlights
David Bennett is currently employed at Intel Corporation, where he applies his expertise in semiconductor innovations. His work focuses on enhancing the efficiency and performance of electronic devices through advanced via structures.
Collaborations
David has collaborated with talented coworkers, including Payam Amin and Tofizur Rahman, contributing to various projects within the company.
Conclusion
David Bennett's innovative work in via structures exemplifies the importance of advancements in semiconductor technology. His contributions continue to influence the industry and pave the way for future innovations.