The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Apr. 14, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shih-Yu Tu, Zhubei, TW;

Chieh Hsieh, Taoyuan, TW;

Shang-Chieh Chien, New Taipei, TW;

Sheng-Kang Yu, Hsinchu, TW;

Li-Jui Chen, Hsinchu, TW;

Heng-Hsin Liu, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70916 (2013.01); G03F 7/70033 (2013.01); G03F 7/70925 (2013.01);
Abstract

A coating is included on one or more components of a lithography system. The coating reduces surface roughness of the one or more surfaces, increases flatness of the one or more surfaces, and/or increases uniformity of the one or more surfaces. The coating may be formed on the one or more surfaces using one or more of the techniques described herein. The coating is configured to reduce adhesion of target material particles to the one or more surfaces, is configured to resist buildup of target material particles on the one or more surfaces, is configured to provide resistance against oxidation of the one or more surfaces, is configured to resist thermal damage of the one or more surfaces, and/or is configured to enable the lithography system to operate at higher operating temperatures, among other examples.


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