The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Jun. 28, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Cory Bomberger, Portland, OR (US);

Anand Murthy, Portland, OR (US);

Biswajeet Guha, Hillsboro, OR (US);

Anupama Bowonder, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/822 (2025.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 30/69 (2025.01); H10D 62/00 (2025.01); H10D 62/13 (2025.01); H10D 62/834 (2025.01); H01L 21/762 (2006.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01); H10D 89/10 (2025.01);
U.S. Cl.
CPC ...
H10D 62/822 (2025.01); H01L 21/02532 (2013.01); H01L 21/30604 (2013.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01); H10D 30/6219 (2025.01); H10D 30/797 (2025.01); H10D 62/021 (2025.01); H10D 62/151 (2025.01); H10D 62/834 (2025.01); H01L 21/76224 (2013.01); H10D 64/017 (2025.01); H10D 84/013 (2025.01); H10D 84/0151 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01); H10D 84/834 (2025.01); H10D 89/10 (2025.01);
Abstract

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having source or drain structures with a relatively high germanium content are described. In an example, an integrated circuit structure includes a fin including a semiconductor material. A gate stack is over an upper fin portion of the fin. A first epitaxial source or drain structure is embedded in the fin at a first side of the gate stack. A second epitaxial source or drain structure is embedded in the fin at a second side of the gate stack. The first and second epitaxial source or drain structures include silicon and germanium and have a same or greater atomic concentration of germanium than the fin.


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