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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12338531 B1

PDFFull Text
Date of Patent:
Jun. 24, 2025

Filed:

Jan. 30, 2024

Spatially tunable deposition to compensate within wafer differential bow

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Fayaz A. Shaikh, Lake Oswego, OR (US);

Adriana Vintila, Wilsonville, OR (US);

Matthew Mudrow, Tigard, OR (US);

Nick Ray Linebarger, Jr., Tualatin, OR (US);

Xin Yin, Beaverton, OR (US);

James F. Lee, Casper, WY (US);

Brian Joseph Williams, Tigard, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:

Weaver Austin Villeneuve & Sampson LLP

Primary Examiner:

Rudy Zervigon

Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/04 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); C23C 16/509 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4585 (2013.01); C23C 16/042 (2013.01); C23C 16/4409 (2013.01); C23C 16/45521 (2013.01); C23C 16/45565 (2013.01); C23C 16/45574 (2013.01); C23C 16/45597 (2013.01); C23C 16/509 (2013.01);
Abstract

A plasma processing chamber for depositing a film on an underside surface of a wafer, includes a showerhead pedestal. The showerhead pedestal includes a first zone and a second zone. The first zone is configured for depositing a first film to the underside surface of the wafer and the second zone is configured for depositing a second film to the underside surface of the wafer.

Find Patent Forward Citations

Shaikh, Fayaz. (2025). Spatially tunable deposition to compensate within wafer differential bow (U.S. Patent No. 12338531). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12338531

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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