Tigard, OR, United States of America

Brian Joseph Williams

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.1

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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6 patents (USPTO):

Title: Innovations of Brian Joseph Williams

Introduction

Brian Joseph Williams is a notable inventor based in Tigard, Oregon. He has made significant contributions to the field of semiconductor processing, holding a total of six patents. His work primarily focuses on improving deposition techniques in wafer processing.

Latest Patents

One of his latest patents is titled "Carrier ring designs for controlling deposition on wafer bevel/edge." This invention provides various carrier ring designs and configurations that control the amount of deposition at a wafer's front side and bevel edge. The designs aim to manage deposition while processing the wafer's back side, ensuring no deposition occurs on the front side. The carrier rings are engineered to control gas flows and plasma effects, with some designs incorporating through holes to enhance gas flow management. Another significant patent is "Spatially tunable deposition to compensate within wafer differential bow." This invention features a plasma processing chamber equipped with a showerhead pedestal that allows for the deposition of different films on the underside surface of a wafer.

Career Highlights

Brian Joseph Williams is currently employed at Lam Research Corporation, a leading company in semiconductor manufacturing equipment. His innovative work has contributed to advancements in the industry, particularly in the area of wafer processing.

Collaborations

Throughout his career, Williams has collaborated with notable colleagues, including Michael John Janicki and Fayaz A. Shaikh. These collaborations have further enhanced the development of his patented technologies.

Conclusion

Brian Joseph Williams is a distinguished inventor whose work in semiconductor processing has led to several impactful patents. His contributions continue to shape the future of wafer processing technologies.

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