The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Dec. 18, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shu-Shen Yeh, Taoyuan, TW;
Che-Chia Yang, Taipei, TW;
Chin-Hua Wang, New Taipei, TW;
Chia-Kuei Hsu, Hsinchu, TW;
Po-Yao Lin, Zhudong Township, TW;
Shin-Puu Jeng, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A package structure and a method of forming the same are provided. The package structure includes an integrated circuit die and a redistribution structure bonded to the integrated circuit die. The redistribution structure includes a first insulating layer, a second insulating layer interposed between the first insulating layer and the integrated circuit die, and a first metallization pattern in the first insulating layer and the second insulating layer. The first metallization pattern includes a first conductive line and a first conductive via coupled to the first conductive line. The first conductive line is in the second insulating layer. The first conductive via is in the first insulating layer. The first conductive line includes a first conductive pad coupled to the first conductive via, a second conductive pad, and a curved portion connecting the first conductive pad to the second conductive pad.