Che-Chia Yang

This inventor holds 33 USPTO granted patents and 20 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2020-2026.

USPTO Granted Patents = 33 (Patent Applications = 20)

% Patents Active = 100.0

Average Co-Inventor Count = 6.2

ph-index = 2

Forward Citations = 20(Granted Patents)

Company Filing History:

32 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 437

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2020-2026

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Areas of Expertise:

Package Structure

Chip Package Structure

Stress Reduction

Warpage Control

Inclined Sidewalls

Eccentric Via Structures

Manufacturing Method

Multi-Lid Structures

Underfill

Curved Conductive Lines

Dummy Dies

Buffer Structure

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12616029 - Package structure with stiffener ring having slant sidewall (2026-04-28),

2. 12557656 - Stacking via structures for stress reduction (2026-02-17),

3. 12538852 - Package structure containing chip structure with inclined sidewalls (2026-01-27),

4. 12444696 - Package structure (2025-10-14),

5. 12406898 - Chip package structure with lid (2025-09-02),

6. 12387991 - Manufacturing method of semiconductor package (2025-08-12),

7. 12368114 - Semiconductor device package having warpage control and method of forming the same (2025-07-22),

8. 12368080 - Chip package structure with ring structure (2025-07-22),

9. 12322704 - Package structure with underfill (2025-06-03),

10. 12322703 - Eccentric via structures for stress reduction (2025-06-03),

11. 12266635 - Semiconductor device package having dummy dies (2025-04-01),

12. 12261102 - Semiconductor package and method of forming the same (2025-03-25),

13. 12237276 - Package structure (2025-02-25),

14. 12170238 - Semiconductor die package with multi-lid structures and method for forming the same (2024-12-17),

15. 12148684 - Package structure and method (2024-11-19),

Title: Inventor Che-Chia Yang - Revolutionizing Technology in Taipei

Introduction: Che-Chia Yang is a pioneering inventor based in Taipei, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yang holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Che-Chia Yang has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Yang has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange that has led to the successful implementation of numerous groundbreaking projects.

Conclusion: Che-Chia Yang's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his reputation as a visionary inventor in Taipei and beyond.