The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

May. 11, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Tetsuya Ishikawa, San Jose, CA (US);

Swaminathan T. Srinivasan, Pleasanton, CA (US);

Kartik Bhupendra Shah, Saratoga, CA (US);

Ala Moradian, Sunnyvale, CA (US);

Manjunath Subbanna, Bangalore, IN;

Matthias Bauer, Sunnyvale, CA (US);

Peter Reimer, Los Altos, CA (US);

Michael R. Rice, Pleasanton, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/14 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/48 (2006.01); C30B 25/08 (2006.01); C30B 25/10 (2006.01); C30B 25/12 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
C30B 25/14 (2013.01); C23C 16/4412 (2013.01); C23C 16/455 (2013.01); C23C 16/45504 (2013.01); C23C 16/4558 (2013.01); C23C 16/46 (2013.01); C30B 25/08 (2013.01); C30B 25/10 (2013.01); C30B 25/12 (2013.01); H01L 21/67115 (2013.01); H01L 21/67742 (2013.01); C23C 16/4411 (2013.01); C23C 16/4584 (2013.01); C23C 16/482 (2013.01); H01L 21/67748 (2013.01);
Abstract

The present disclosure generally relates to a process chamber for processing of semiconductor substrates. The process chamber includes an upper lamp assembly, a lower lamp assembly, a substrate support, an upper window disposed between the substrate support and the upper lamp assembly, a lower window disposed between the lower lamp assembly and the substrate support, an inject ring, and a base ring. Each of the upper lamp assembly and the lower lamp assembly include vertically oriented lamp apertures for the placement of heating lamps therein. The inject ring includes gas injectors disposed therethrough and the base ring includes a substrate transfer passage, a lower chamber exhaust passage, and one or more upper chamber exhaust passages. The gas injectors are disposed over the substrate transfer passage and across from the lower chamber exhaust passage and the one or more upper chamber exhaust passages.


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